CY62158DV30LL-55BVIT
vs
CY62158DV30L-55BVIT
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
6 X 8 MM, 1 MM HEIGHT, VFBGA-48
|
VFBGA,
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
55 ns
|
55 ns
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
JESD-609 Code |
e0
|
e0
|
Length |
8 mm
|
8 mm
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1MX8
|
1MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.2 V
|
2.2 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.75 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Supply Current-Max |
|
0.02 mA
|
|
|
|
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