CY62157EV30LL-45ZSXI
vs
K6F8016U3M-TB70
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
TSOP2-44
TSOP2, TSOP44,.46,32
Pin Count
44
44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
JESD-609 Code
e4
e0
Length
18.415 mm
18.41 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Equivalence Code
TSOP44,.46,32
TSOP44,.46,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.194 mm
1.2 mm
Standby Current-Max
0.000005 A
0.000006 A
Standby Voltage-Min
1.5 V
1.5 V
Supply Current-Max
0.025 mA
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.3 V
Supply Voltage-Min (Vsup)
2.2 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
10.16 mm
10.16 mm
Base Number Matches
2
1
Compare CY62157EV30LL-45ZSXI with alternatives
Compare K6F8016U3M-TB70 with alternatives