CY62136VNLL-70BAI
vs
CY62136EV30LL-45BVXI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INFINEON TECHNOLOGIES AG
Part Package Code
BGA
Package Description
7 X 7 MM, FBGA-48
VFBGA-48
Pin Count
48
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
70 ns
45 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e1
Length
7 mm
8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX16
128KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Standby Current-Max
0.0000075 A
0.000003 A
Standby Voltage-Min
1 V
1 V
Supply Current-Max
0.015 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.2 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
7 mm
6 mm
Base Number Matches
2
2
Factory Lead Time
2 Days
Samacsys Manufacturer
Infineon
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