CY62128BLL-70ZXE
vs
P4C1024L70TC
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PYRAMID SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP1
|
TSOP
|
| Package Description |
TSOP1,
|
8 X 20 MM, TSOP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
70 ns
|
70 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| JESD-609 Code |
e3/e4
|
|
| Length |
18.4 mm
|
18.4 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
LSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2192 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN/NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
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