CY37064VP100-100ACT
vs
ISPLSI2064VE-280LB100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
PLASTIC, TQFP-100
10 X 10 MM, 0.80 MM PITCH, CABGA-100
Pin Count
100
100
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
64 MACROCELLS
YES
Clock Frequency-Max
80 MHz
182 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PQFP-G100
S-PBGA-B100
JESD-609 Code
e0
e0
JTAG BST
YES
NO
Length
14 mm
10 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
1
Number of I/O Lines
69
64
Number of Macro Cells
64
64
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1 DEDICATED INPUTS, 69 I/O
0 DEDICATED INPUTS, 64 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFBGA
Package Equivalence Code
QFP100,.63SQ,20
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
5.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
14 mm
10 mm
Base Number Matches
1
1
Compare CY37064VP100-100ACT with alternatives
Compare ISPLSI2064VE-280LB100 with alternatives