CY27S03PC vs AM3101-1DC feature comparison

CY27S03PC Cypress Semiconductor

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AM3101-1DC AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature INVERTED OUTPUT
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Length 19.177 mm 19.431 mm
Memory Density 64 bit 64 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 16X4 16X4
Output Characteristics 3-STATE OPEN-COLLECTOR
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 5.08 mm
Supply Current-Max 0.09 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code No

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Compare AM3101-1DC with alternatives