CY27H512-55QMB
vs
AM28F512-150DCB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
QFJ
DIP
Package Description
QCCN, LCC32,.45X.55
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.51
Access Time-Max
55 ns
150 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
R-GDIP-T32
JESD-609 Code
e0
e0
Memory Density
524288 bit
524288 bit
Memory IC Type
UVPROM
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Equivalence Code
LCC32,.45X.55
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.025 A
0.0001 A
Supply Current-Max
0.06 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
Additional Feature
BULK ERASE
Command User Interface
YES
Data Polling
NO
Endurance
10000 Write/Erase Cycles
Length
42.1005 mm
Programming Voltage
12 V
Seated Height-Max
5.588 mm
Toggle Bit
NO
Type
NOR TYPE
Width
15.24 mm
Compare CY27H512-55QMB with alternatives
Compare AM28F512-150DCB with alternatives