CY27H256-70JCT
vs
AM27X256-70JC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ,
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.05 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Base Number Matches
1
3
Rohs Code
Additional Feature
EXPRESS
JESD-609 Code
e0
Package Equivalence Code
LDCC32,.5X.6
Standby Current-Max
0.0001 A
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Compare CY27H256-70JCT with alternatives
Compare AM27X256-70JC with alternatives