CY27H010-30JCR
vs
CY7B201-30WC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFJ
DIP
Package Description
QCCJ,
0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
30 ns
30 ns
JESD-30 Code
R-PQCC-J32
R-GDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
POWER DOWN PROM
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
DIP32,.3
Supply Current-Max
0.05 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare CY27H010-30JCR with alternatives
Compare CY7B201-30WC with alternatives