CY27C256A-90QMB
vs
AS27C256A-90ECAM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MICROSS COMPONENTS
Part Package Code
QFJ
QFJ
Package Description
HERMETIC SEALED, WINDOWED, LCC-32
,
Pin Count
32
32
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
90 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
JESD-609 Code
e0
Length
13.97 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WQCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.794 mm
Standby Current-Max
0.025 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Width
11.43 mm
Base Number Matches
2
1
Compare CY27C256A-90QMB with alternatives
Compare AS27C256A-90ECAM with alternatives