CY27C256A-70JC vs AM27C64-200DI feature comparison

CY27C256A-70JC Rochester Electronics LLC

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AM27C64-200DI Rochester Electronics LLC

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Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ROCHESTER ELECTRONICS LLC
Package Description PLASTIC, LCC-32 WINDOWED, CERAMIC, DIP-28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 70 ns 200 ns
JESD-30 Code R-PQCC-J32 R-CDIP-T28
Memory Density 262144 bit 65536 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 32768 words 8192 words
Number of Words Code 32000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Position QUAD DUAL
Base Number Matches 2 4
Supply Current-Max 0.025 mA

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