CY2313NZSC-1
vs
MPC940LFA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.300 INCH, PLASTIC, SOIC-28
|
7 X 7 MM, LQFP-32
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
2313
|
MPC900
|
| Input Conditioning |
STANDARD
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G32
|
| JESD-609 Code |
e0
|
e0
|
| Length |
17.9 mm
|
7 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
28
|
32
|
| Number of True Outputs |
13
|
18
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LQFP
|
| Package Equivalence Code |
SOP28,.4
|
QFP32,.35SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE
|
| Propagation Delay (tpd) |
5 ns
|
5.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.2 ns
|
0.2 ns
|
| Seated Height-Max |
2.65 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.5 mm
|
7 mm
|
| fmax-Min |
100 MHz
|
250 MHz
|
| Base Number Matches |
1
|
5
|
| Additional Feature |
|
CAN ALSO OPERATE AT 3.3V SUPPLY
|
| Max I(ol) |
|
0.02 A
|
|
|
|
Compare CY2313NZSC-1 with alternatives