CY2304NZZXI-1
vs
NB2304AC1D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
SOIC
Package Description
TSSOP-8
0.150 INCH, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
2304
2304
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.4 mm
4.9 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
3
NOT SPECIFIED
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
8
8
Number of True Outputs
4
4
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Prop. Delay@Nom-Sup
5 ns
Propagation Delay (tpd)
5 ns
Qualification Status
Not Qualified
COMMERCIAL
Same Edge Skew-Max (tskwd)
0.1 ns
0.2 ns
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
30
Width
3 mm
3.9 mm
fmax-Min
140 MHz
133.3 MHz
Base Number Matches
2
2
Technology
CMOS
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