CY2147-55DC vs AM21L47-55DC feature comparison

CY2147-55DC Cypress Semiconductor

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AM21L47-55DC Msis Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MSIS SEMICONDUCTOR INC
Part Package Code DIP
Package Description 0.300 INCH, CERDIP-18 DIP, DIP18,.3
Pin Count 18
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE SEPARATE
JESD-30 Code R-GDIP-T18 R-XDIP-T18
JESD-609 Code e0 e0
Length 22.606 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1
Number of Ports 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.025 A 0.015 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.125 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 2

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