CY14E108N-ZSP25XIT
vs
CY14B108M-ZSP25XI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSOP2
TSOP2
Package Description
TSOP2,
TSOP2-54
Pin Count
54
54
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
JESD-609 Code
e3
e3
Length
22.415 mm
22.415 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
54
54
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
20
Width
10.16 mm
10.16 mm
Base Number Matches
1
2
Package Equivalence Code
TSOP54,.46,32
Standby Current-Max
0.01 A
Supply Current-Max
0.075 mA
Compare CY14E108N-ZSP25XIT with alternatives
Compare CY14B108M-ZSP25XI with alternatives