CY14B256Q2-LHXI
vs
N256S0830HDAS225
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
AMI SEMICONDUCTOR
Part Package Code
DFN
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
JESD-30 Code
R-PDSO-N8
R-PDSO-G8
JESD-609 Code
e4
e3/e4
Length
6 mm
4.9 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.75 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.01 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN/NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
5 mm
3.91 mm
Base Number Matches
2
2
Package Description
0.150 INCH, GREEN, PLASTIC, SOIC-8
Access Time-Max
20 ns
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