CY14B256LA-SZ25XIT
vs
STK14D88NF25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SIMTEK CORP
Part Package Code
SOIC
SOIC
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e3
e3
Length
20.726 mm
20.725 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP32,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
7.505 mm
7.51 mm
Base Number Matches
2
1
Package Description
SOP,
Compare CY14B256LA-SZ25XIT with alternatives
Compare STK14D88NF25 with alternatives