CY14B108N-BA25XIT
vs
STK14EE16-BF25I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SIMTEK CORP
Part Package Code
BGA
BGA
Package Description
FBGA-48
TFBGA,
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e4
Length
10 mm
10 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
NON-VOLATILE SRAM
NON-VOLATILE SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.01 A
Supply Current-Max
0.075 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
NICKEL PALLADIUM GOLD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
6 mm
6 mm
Base Number Matches
2
2
Compare CY14B108N-BA25XIT with alternatives
Compare STK14EE16-BF25I with alternatives