CXM3580UR
vs
MICRF506BMLTR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
MICREL INC
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
VQCCN,
|
HVQCCN, LCC32,.2SQ,20
|
| Pin Count |
26
|
32
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PQCC-N26
|
S-XQCC-N32
|
| Length |
3.4 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
26
|
32
|
| Operating Temperature-Max |
90 °C
|
85 °C
|
| Operating Temperature-Min |
-35 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Seated Height-Max |
0.6 mm
|
1 mm
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
2.6 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
MLF
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.000003 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare CXM3580UR with alternatives
Compare MICRF506BMLTR with alternatives