CXK79M36C161GB-33 vs GS8170DW36C-333T feature comparison

CXK79M36C161GB-33 Sony Semiconductor

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GS8170DW36C-333T GSI Technology

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA209,11X19,40 14 X 22 MM, 1 MM PITCH, BGA-209
Pin Count 209 209
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.8 ns 1.8 ns
Additional Feature PIPELINED ARCHITECTURE; LATE WRITE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 303 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e0
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Organization 512KX36 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.3 mm 1.7 mm
Standby Current-Max 0.25 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.63 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220

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