CXK79M18C161GB-44
vs
GS8170DW18GC-300
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SONY CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
BGA, BGA209,11X19,40
LBGA,
Pin Count
209
209
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.3 ns
5.5 ns
Clock Frequency-Max (fCLK)
227 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e0
e1
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Organization
1MX18
1MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.3 mm
1.7 mm
Standby Current-Max
0.25 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.42 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Additional Feature
PIPELINED ARCHITECTURE
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare CXK79M18C161GB-44 with alternatives
Compare GS8170DW18GC-300 with alternatives