CXK5971P-25 vs IDT7169L25TDB feature comparison

CXK5971P-25 Sony Semiconductor

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IDT7169L25TDB Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-28 0.300 INCH, CERDIP-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 35.1 mm 37.211 mm
Memory Density 73728 bit 73728 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 9 9
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX9 8KX9
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.4 mm 5.08 mm
Standby Current-Max 0.0001 A 0.0002 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.09 mA 0.17 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

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