CXK5971AP-25
vs
5962-8868303YX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SONY CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.3
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
R-XDIP-T28
JESD-609 Code
e0
Length
35.1 mm
Memory Density
73728 bit
73728 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX9
8KX9
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.4 mm
5.08 mm
Standby Current-Max
0.00005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Screening Level
MIL-STD-883
Compare CXK5971AP-25 with alternatives
Compare 5962-8868303YX with alternatives