CXK5864BSP-10LL
vs
WS128K32-55HSM
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP28,.3
|
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
100 ns
|
55 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDIP-T28
|
S-CPGA-P66
|
| JESD-609 Code |
e0
|
|
| Length |
35.1 mm
|
30.1 mm
|
| Memory Density |
65536 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
28
|
66
|
| Number of Words |
8192 words
|
262144 words
|
| Number of Words Code |
8000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
8KX8
|
256K16
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
PGA
|
| Package Equivalence Code |
DIP28,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.4 mm
|
6.22 mm
|
| Standby Current-Max |
0.000015 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.05 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
PERPENDICULAR
|
| Width |
7.62 mm
|
30.1 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
USER CONFIGURABLE AS 128K X 32
|
| Alternate Memory Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-STD-883
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CXK5864BSP-10LL with alternatives
Compare WS128K32-55HSM with alternatives