CXK58267AP-85LL vs MSM832SLI-85 feature comparison

CXK58267AP-85LL Sony Semiconductor

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MSM832SLI-85 APTA Group Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP APTA GROUP INC
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 85 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e0
Length 36.8 mm 35.56 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm 4.45 mm
Standby Current-Max 0.000003 A 0.00017 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.05 mA 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2

Compare CXK58267AP-85LL with alternatives

Compare MSM832SLI-85 with alternatives