CXK581000P-10LX
vs
MB841000-10P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SONY CORP
FUJITSU LTD
Part Package Code
DIP
DIP
Package Description
DIP, DIP32,.6
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
100 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T32
R-PDIP-T32
JESD-609 Code
e0
e0
Length
40.2 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5 mm
Standby Voltage-Min
2.2 V
2 V
Supply Current-Max
0.06 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
2
Standby Current-Max
0.0005 A
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