CXK54256P-45 vs MSM832TLMB-10 feature comparison

CXK54256P-45 Sony Semiconductor

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MSM832TLMB-10 Mosaic Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP MOSAIC SEMICONDUCTOR INC
Package Description DIP, DIP24,.3 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 100 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-CDIP-T28
JESD-609 Code e0
Length 30 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 8
Number of Functions 1 1
Number of Terminals 24 28
Number of Words 65536 words 32768 words
Number of Words Code 64000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX4 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.4 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.085 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2
Part Package Code DIP
Pin Count 28
Number of Ports 1
Output Enable YES
Screening Level MIL-STD-883

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Compare MSM832TLMB-10 with alternatives