CXD1175AM
vs
HI1179JCQ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
QFP
|
| Package Description |
SOP, SOP24,.3
|
PLASTIC, MQFP-32
|
| Pin Count |
24
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2.8 V
|
2.5 V
|
| Analog Input Voltage-Min |
|
0.5 V
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQFP-G32
|
| JESD-609 Code |
e6/e4
|
e0
|
| Length |
15 mm
|
7 mm
|
| Linearity Error-Max (EL) |
0.5078%
|
0.5078%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QFP
|
| Package Equivalence Code |
SOP24,.3
|
QFP32,.35SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
20 MHz
|
35 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
|
| Seated Height-Max |
2.25 mm
|
1.2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN BISMUTH/PALLADIUM
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
7 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
|
|
|
Compare CXD1175AM with alternatives
Compare HI1179JCQ with alternatives