CXD1171M
vs
HI1171JCB-T
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP24,.3
|
0.200 INCH, PLASTIC, SOIC-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
2.1 V
|
2.1 V
|
| Analog Output Voltage-Min |
1.9 V
|
0.5 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e6
|
e3
|
| Length |
15 mm
|
15.15 mm
|
| Linearity Error-Max (EL) |
0.5078%
|
0.5078%
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP24,.3
|
SOP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.25 mm
|
2.25 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Bismuth (Sn/Bi)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
5.3 mm
|
5.4 mm
|
| Base Number Matches |
1
|
1
|
| Settling Time-Max |
|
0.015 µs
|
| Settling Time-Nom (tstl) |
|
0.01 µs
|
| Supply Current-Max |
|
11.5 mA
|
|
|
|
Compare CXD1171M with alternatives
Compare HI1171JCB-T with alternatives