CXB1116QY
vs
74ACT11579N
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SONY CORP
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP24,.44SQ,30
|
DIP, DIP24,.3
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
DIFFERENTIAL CLOCK INPUT; OPTEMP SPECIFIED AS TC
|
|
| Count Direction |
DOWN
|
BIDIRECTIONAL
|
| Family |
1000
|
ACT
|
| JESD-30 Code |
S-MQFP-G24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Load Capacitance (CL) |
2 pF
|
50 pF
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
2400000000 Hz
|
|
| Mode of Operation |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
4
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
3-STATE
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
DIP
|
| Package Equivalence Code |
QFP24,.44SQ,30
|
DIP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
213 mA
|
|
| Propagation Delay (tpd) |
1.6 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.52 mm
|
|
| Supply Voltage-Max (Vsup) |
-4.8 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
-4.2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
-4.5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.762 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| fmax-Min |
2400 MHz
|
|
| Base Number Matches |
1
|
2
|
| Max I(ol) |
|
0.024 A
|
|
|
|
Compare CXB1116QY with alternatives