CV235-7PAGG4
vs
LH540235M25
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SHARP CORP
|
Part Package Code |
QFP
|
|
Package Description |
TFQFP, TQFP64,.47SQ
|
LQFP,
|
Pin Count |
64
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
5 ns
|
|
Clock Frequency-Max (fCLK) |
133 MHz
|
|
Cycle Time |
7.5 ns
|
25 ns
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e4
|
e0
|
Length |
10 mm
|
14 mm
|
Memory Density |
36864 bit
|
36864 bit
|
Memory IC Type |
OTHER FIFO
|
|
Memory Width |
18
|
18
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Number of Words |
2048 words
|
2048 words
|
Number of Words Code |
2000
|
2000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
2KX18
|
2KX18
|
Output Enable |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
LQFP
|
Package Equivalence Code |
TQFP64,.47SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.6 mm
|
Supply Current-Max |
0.035 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CV235-7PAGG4 with alternatives
Compare LH540235M25 with alternatives