CURMT105-HF
vs
HFM105-MH
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
COMCHIP TECHNOLOGY CO LTD
|
FORMOSA MICROSEMI CO LTD
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.7 V
|
1.7 V
|
| JESD-609 Code |
e3
|
|
| Non-rep Pk Forward Current-Max |
25 A
|
25 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
SMA, 2 PIN
|
| HTS Code |
|
8541.10.00.80
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
R-PDSO-F2
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Reverse Recovery Time-Max |
|
0.075 µs
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare CURMT105-HF with alternatives
Compare HFM105-MH with alternatives