CS18LV21493ECR70 vs R1LV0208BSA-7SR#B0 feature comparison

CS18LV21493ECR70 Chiplus Semiconductor Corp

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R1LV0208BSA-7SR#B0 Renesas Electronics Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer CHIPLUS SEMICONDUCTOR CORP RENESAS ELECTRONICS CORP
Package Description TSOP1-32 TSSOP, TSSOP32,.56,20
Reach Compliance Code compliant compliant
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 18.4 mm 11.8 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX8 256KX8
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Equivalence Code TSOP32,.8,20 TSSOP32,.56,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.000008 A 0.000008 A
Standby Voltage-Min 1.5 V 2 V
Supply Current-Max 0.015 mA 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code TSOP
Pin Count 32
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Output Characteristics 3-STATE
Qualification Status Not Qualified

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