CS18LV21493DCR45
vs
IS62WV2568EBLL-45TLI-TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
CHIPLUS SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Package Description
STSOP1-32
TSOP1,
Reach Compliance Code
compliant
compliant
Access Time-Max
45 ns
45 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
11.8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX8
256KX8
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP32,.56,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
1.2 mm
Standby Current-Max
0.000008 A
Standby Voltage-Min
1.5 V
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.2 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
DUAL
Width
8 mm
Base Number Matches
1
1
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Factory Lead Time
10 Weeks
Samacsys Manufacturer
Integrated Silicon Solution Inc.
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CS18LV21493DCR45 with alternatives
Compare IS62WV2568EBLL-45TLI-TR with alternatives