CRGP0805J56K vs HP05W3J0563TEE feature comparison

CRGP0805J56K TE Connectivity

Buy Now Datasheet

HP05W3J0563TEE Royal Electronic Factory (Thailand) Co Ltd

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 2 mm 2 mm
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, Paper, 7 Inch TR
Rated Power Dissipation (P) 0.33 W 0.333 W
Rated Temperature 70 °C
Reference Standard AEC-Q200
Resistance 56000 Ω 56000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Rohs Code Yes
Series HP

Compare CRGP0805J56K with alternatives

Compare HP05W3J0563TEE with alternatives