CRGCQ2010J8K2 vs MC2010L6J8201SE feature comparison

CRGCQ2010J8K2 TE Connectivity

Buy Now Datasheet

MC2010L6J8201SE SPC Multicomp

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TE CONNECTIVITY LTD SPC TECHNOLOGY/ MULTICOMP
Package Description CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Multilayer Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, PAPER, 7 INCH TR, Embossed Plastic, 7 Inch
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Reference Standard AEC-Q200
Resistance 8200 Ω 8200 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare CRGCQ2010J8K2 with alternatives

Compare MC2010L6J8201SE with alternatives