CRG2010F2K21 vs 201007F2211B4 feature comparison

CRG2010F2K21 TE Connectivity

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201007F2211B4 Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature LASER TRIMMABLE
Construction RECTANGULAR PACKAGE Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C
Resistance 2210 Ω 2210 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn)
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(3/4WS,F TOL)

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