CRG2010F1K13 vs MC2010-1131-FB feature comparison

CRG2010F1K13 TE Connectivity

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MC2010-1131-FB RCD Components Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TE CONNECTIVITY LTD RCD COMPONENTS INC
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature LASER TRIMMABLE
Construction RECTANGULAR PACKAGE Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.6 mm
Packing Method TR, EMBOSSED, 7 INCH Bulk
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C 70 °C
Resistance 1130 Ω 1130 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn)
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1

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Compare MC2010-1131-FB with alternatives