CR21-33R0-FL
vs
RC2012F330GS
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ASJ PTE LTD
SAMSUNG ELECTRO-MECHANICS
Package Description
CHIP
Reach Compliance Code
compliant
compliant
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.5 mm
0.5 mm
Package Length
2 mm
2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
TR, Punched Paper, 7 Inch
Bulk
Rated Power Dissipation (P)
0.125 W
0.125 W
Rated Temperature
70 °C
Reference Standard
AEC-Q200
Resistance
33 Ω
33 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
1%
Working Voltage
150 V
150 V
Base Number Matches
3
1
ECCN Code
EAR99
Compare CR21-33R0-FL with alternatives
Compare RC2012F330GS with alternatives