CR1206F1211T1LF
vs
CR32-1211F-T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
CHIP TECHNOLOGIES INC
|
AVX CORP
|
| Package Description |
CHIP, ROHS COMPLIANT
|
CHIP
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Packing Method |
TR, PAPER, 7 INCH
|
TR, PUNCHED PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
1210 Ω
|
1210 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.30
|
| Construction |
|
Chip
|
| Package Height |
|
0.55 mm
|
| Package Length |
|
3.1 mm
|
| Package Style |
|
SMT
|
| Package Width |
|
1.55 mm
|
| Temperature Coefficient |
|
100 ppm/°C
|
|
|
|
Compare CR1206F1211T1LF with alternatives
Compare CR32-1211F-T with alternatives