CR0805F60R4T1LF vs RM10FBN60R4 feature comparison

CR0805F60R4T1LF Chip Technologies Inc

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RM10FBN60R4 TA-I Technology Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer CHIP TECHNOLOGIES INC TA-I TECHNOLOGY CO LTD
Package Description CHIP CHIP, LEAD FREE
Reach Compliance Code unknown compliant
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Packing Method TR, PAPER, 7 INCH BULK CASSETTE
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C 70 °C
Resistance 60.4 Ω 60.4 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 2 1
Pbfree Code Yes
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Chip
Package Height 0.5 mm
Package Length 2 mm
Package Style SMT
Package Width 1.25 mm

Compare CR0805F60R4T1LF with alternatives

Compare RM10FBN60R4 with alternatives