CR0603F1051T1LF vs MCR03FZHFX1051 feature comparison

CR0603F1051T1LF Chip Technologies Inc

Buy Now Datasheet

MCR03FZHFX1051 ROHM Semiconductor

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer CHIP TECHNOLOGIES INC ROHM CO LTD
Package Description CHIP, ROHS COMPLIANT CHIP
Reach Compliance Code unknown compliant
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Packing Method TR, PAPER, 7 INCH TR, PAPER
Rated Power Dissipation (P) 0.1 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 1050 Ω 1050 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn)
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Chip
Manufacturer Series MCR03
Package Height 0.45 mm
Package Length 1.6 mm
Package Style SMT
Package Width 0.8 mm
Series MCR03(FX,E-96)

Compare CR0603F1051T1LF with alternatives

Compare MCR03FZHFX1051 with alternatives