COM20020IP
vs
COM20020I-P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STANDARD MICROSYSTEMS CORP
STANDARD MICROSYSTEMS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP-24
Pin Count
24
24
Reach Compliance Code
unknown
unknown
Address Bus Width
3
3
Boundary Scan
NO
NO
Bus Compatibility
8051; 6801
8051; 6801
Clock Frequency-Max
40 MHz
40 MHz
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.625 MBps
0.625 MBps
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
31.877 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of I/O Lines
Number of Serial I/Os
1
1
Number of Terminals
24
24
On Chip Data RAM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
235
235
Qualification Status
Not Qualified
Not Qualified
RAM (words)
2000
Seated Height-Max
3.81 mm
3.81 mm
Supply Current-Max
50 mA
50 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, LAN
SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches
3
3
HTS Code
8542.31.00.01
Communication Protocol
ETHERNET
Package Equivalence Code
DIP24,.6
Compare COM20020IP with alternatives
Compare COM20020I-P with alternatives