COM20019ILJP vs COM20019I-HD feature comparison

COM20019ILJP SMSC

Buy Now Datasheet

COM20019I-HD Microchip Technology Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STANDARD MICROSYSTEMS CORP MICROCHIP TECHNOLOGY INC
Part Package Code QLCC
Package Description QCCJ, LDCC28,.5SQ TQFP-48
Pin Count 28
Reach Compliance Code compliant compliant
Address Bus Width 3 3
Boundary Scan NO NO
Bus Compatibility 8051; 6801 ISA; RS485
Clock Frequency-Max 20 MHz 20 MHz
Data Transfer Rate-Max 0.03814697265625 MBps 0.0390625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J28 S-PQFP-G48
JESD-609 Code e0
Length 11.5062 mm 7 mm
Low Power Mode NO YES
Number of Serial I/Os 1
Number of Terminals 28 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC28,.5SQ QFP48,.28SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 5 V
Qualification Status Not Qualified
Seated Height-Max 4.572 mm 1.6 mm
Supply Current-Max 50 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 11.5062 mm 7 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches 1 2
HTS Code 8542.31.00.01
Communication Protocol SYNC, BYTE
Number of DMA Channels
Number of I/O Lines
On Chip Data RAM Width 8
RAM (words) 1024
Screening Level TS 16949

Compare COM20019ILJP with alternatives

Compare COM20019I-HD with alternatives