COM20019I-HD
vs
COM20019P
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
STANDARD MICROSYSTEMS CORP
|
Part Package Code |
QFP
|
DIP
|
Package Description |
LFQFP, QFP48,.35SQ,20
|
DIP, DIP24,.6
|
Pin Count |
48
|
24
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
3
|
3
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
8051; 6801
|
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
Data Transfer Rate-Max |
0.03814697265625 MBps
|
0.03814697265625 MBps
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G48
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Length |
7 mm
|
31.877 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
48
|
24
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
DIP
|
Package Equivalence Code |
QFP48,.35SQ,20
|
DIP24,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
235
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
3.81 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
Base Number Matches |
1
|
1
|
Communication Protocol |
|
SYNC, BYTE
|
Supply Current-Max |
|
50 mA
|
|
|
|
Compare COM20019I-HD with alternatives
Compare COM20019P with alternatives