COM20019I-HD
vs
COM20019I-LJP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
STANDARD MICROSYSTEMS CORP
|
| Part Package Code |
QFP
|
QLCC
|
| Package Description |
LFQFP, QFP48,.35SQ,20
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
48
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
8051; 6801
|
8051; 6801
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| Data Transfer Rate-Max |
0.03814697265625 MBps
|
0.03814697265625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
7 mm
|
11.5062 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
48
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QCCJ
|
| Package Equivalence Code |
QFP48,.35SQ,20
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
235
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
4.572 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
11.5062 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
2
|
| Supply Current-Max |
|
50 mA
|
|
|
|
Compare COM20019I-HD with alternatives
Compare COM20019I-LJP with alternatives