COM20019I-DZD vs COM20019P feature comparison

COM20019I-DZD SMSC

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COM20019P SMSC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STANDARD MICROSYSTEMS CORP STANDARD MICROSYSTEMS CORP
Part Package Code QLCC DIP
Package Description QCCJ, DIP, DIP24,.6
Pin Count 28 24
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 3 3
Boundary Scan NO NO
Bus Compatibility 8051; 6801
Clock Frequency-Max 20 MHz 20 MHz
Data Transfer Rate-Max 0.03814697265625 MBps 0.03814697265625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J28 R-PDIP-T24
Length 11.5062 mm 31.877 mm
Low Power Mode NO YES
Number of Serial I/Os 1 1
Number of Terminals 28 24
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 3.81 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.5062 mm 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches 2 1
Communication Protocol SYNC, BYTE
JESD-609 Code e0
Package Equivalence Code DIP24,.6
Supply Current-Max 50 mA
Terminal Finish TIN LEAD

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