CNS1N5294
vs
JAN1N5294UR-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-1
|
HERMETIC SEALED, GLASS, LL41, MELF-2
|
| Pin Count |
1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.40
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JESD-30 Code |
S-XUUC-N1
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e0
|
| Knee Impedance-Max |
335000 Ω
|
|
| Limiting Voltage-Max |
1.2 V
|
1.2 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Power Dissipation-Max |
0.475 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Regulation Current-Nom (Ireg) |
0.75 mA
|
0.75 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
WRAP AROUND
|
| Terminal Position |
UPPER
|
END
|
| Base Number Matches |
1
|
8
|
| Factory Lead Time |
|
21 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| JEDEC-95 Code |
|
DO-213AB
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
MIL-19500
|
|
|
|
Compare CNS1N5294 with alternatives
Compare JAN1N5294UR-1 with alternatives