CND2B10TTD562J
vs
RACF648R5.6K5%R
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
STACKPOLE ELECTRONICS INC
Package Description
CHIP, ROHS COMPLIANT
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
5600 Ω
5600 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, PAPER, 7 INCH
TAPE, EMBOSSED
Rated Temperature
70 °C
70 °C
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Size Code
2512
1225
Surface Mount
YES
YES
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
HTS Code
8533.21.00.20
Construction
Chip
Manufacturer Series
RAC
Package Height
0.6 mm
Package Length
6.4 mm
Package Width
3.1 mm
Rated Power Dissipation (P)
0.063 W
Resistance
5600 Ω
Series
RAC648R(5%)
Technology
METAL GLAZE/THICK FILM
Compare CND2B10TTD562J with alternatives
Compare RACF648R5.6K5%R with alternatives