CND2B10TTD562J vs RACF648R5.6K5%R feature comparison

CND2B10TTD562J KOA Speer Electronics Inc

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RACF648R5.6K5%R SEI Stackpole Electronics Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer KOA SPEER ELECTRONICS INC STACKPOLE ELECTRONICS INC
Package Description CHIP, ROHS COMPLIANT CHIP, ROHS COMPLIANT
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Element Power Dissipation 0.063 W 0.063 W
First Element Resistance 5600 Ω 5600 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type BUSSED BUSSED
Number of Elements 8 8
Number of Functions 1 1
Number of Terminals 10 10
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, PAPER, 7 INCH TAPE, EMBOSSED
Rated Temperature 70 °C 70 °C
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Size Code 2512 1225
Surface Mount YES YES
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
HTS Code 8533.21.00.20
Construction Chip
Manufacturer Series RAC
Package Height 0.6 mm
Package Length 6.4 mm
Package Width 3.1 mm
Rated Power Dissipation (P) 0.063 W
Resistance 5600 Ω
Series RAC648R(5%)
Technology METAL GLAZE/THICK FILM

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