CND2B10LTED822J
vs
CND2B10TTE822J
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
KOA SPEER ELECTRONICS INC
|
KOA SPEER ELECTRONICS INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e0
|
e3
|
| Network Type |
BUSSED
|
BUSSED
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.6 mm
|
| Package Length |
6.4 mm
|
6.4 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
3.1 mm
|
3.1 mm
|
| Packing Method |
TR, 10 Inch
|
TR, EMBOSSED PLASTIC, 7 INCH
|
| Rated Power Dissipation (P) |
0.063 W
|
0.063 W
|
| Resistance |
8200 Ω
|
8200 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
2512
|
1225
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP, ROHS COMPLIANT
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.20
|
| Element Power Dissipation |
|
0.063 W
|
| First Element Resistance |
|
8200 Ω
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Elements |
|
8
|
| Number of Functions |
|
1
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare CND2B10LTED822J with alternatives
Compare CND2B10TTE822J with alternatives